Vacuum-processing chamber-shield and multi-chamber pumping method

ABSTRACT

One or more chambers of a multi-chamber vacuum processing apparatus are provided with a high gas flow conductance path to an exhaust volume of the apparatus that is maintained at high vacuum with a high vacuum pump. Separate pumps for the one or more chambers are made unnecessary by providing such chambers with a protective deposition shield or shield set that is configured to substantially protect walls of the chamber and the gas flow conductance path from deposition and to partially impede the gas flow from the chamber through the gas flow conductance path to the exhaust volume so that the chamber can be operated at a higher pressure than that of the exhaust volume and the chambers can be operated at different pressures and without cross-contamination. Preferably, a nested set of chamber shields is used. A controller is programmed to control the processing of wafers in the chambers by controlling the supply of process gas into the chambers.

This application is a divisional of U.S. patent application Ser. No.10/607,141, filed on Jun. 26, 2003, the entirety of which isincorporated by reference herein.

FIELD OF THE INVENTION

This application relates to vacuum processes such as physical vapordeposition processes, and particularly to single wafer processingmodules that may be used for coating semiconductor wafers. Theapplication particularly relates to the shielding of processing chambersurfaces and to the maintenance and control of the vacuum and gas flowin vacuum processing chambers.

BACKGROUND OF THE INVENTION

A typical physical vapor deposition (PVD) apparatus includes aprocessing chamber, a cathode assembly and a substrate support withinthe chamber, a vacuum system to maintain the pressure in the chamberbelow 100 mTorr and a gas supply system to introduce a sputtering gasinto the chamber. The cathode assembly includes a target, insulators toelectrically isolate that target from the chamber wall, a power supplyto energize the target, and a magnetron magnet assembly to form a plasmaconfining magnetic field close to the target surface. When thesubstrates being processed by the PVD apparatus are silicon wafers forintegrated circuit manufacturing, the most commonly encountered PVDapparatus vacuum systems use high-vacuum cryogenic pumps and severalpressure gauges.

Because sputtered material is ejected from the target in all directionsin the processing chamber of a PVD apparatus, the whole chamber, notjust the substrate, is exposed to coating material from the target.Standard practice has been to place physical barriers known as shieldsinside the chamber so as to prevent unwanted deposition on the chamberwalls and on various other components inside the chamber. For example,shields may be used to protect the dielectric insulator thatelectrically isolates the target from the usually grounded metal chamberwalls. Shields used to protect chamber components usually have theirsurfaces roughened so that material that is deposited onto the shieldsadheres better to the shields and does not spall as it increases inthickness. If the deposited material does not adhere well to theshields, it can flake off, causing particles that can land on thesubstrate. In integrated circuit manufacturing, these particles candestroy sensitive devices on the substrate surface. Usually theseshields must be changed on a regular preventive maintenance schedule.Otherwise the accumulated deposits will become too thick and stresseswill build up that cause the shields to shed particles.

For some sensitive applications, a process chamber must be capable ofbeing evacuated to an ultra-high vacuum (below 10⁻⁸ Torr), and thesputtering gas must be purified before it is introduced into the processchamber. The equipment required to achieve these conditions is veryexpensive. In other semiconductor PVD applications, such equipment isnot required. Some less critical PVD applications used for integratedcircuit manufacture are extremely sensitive to cost, and call forequipment having a minimum of expensive components. Some of the mostexpensive components of a PVD chamber are those required to achieveultra-high vacuum (UHV).

For silicon wafer processing, the process chamber is most commonlypumped by a dedicated high vacuum pump, usually a turbo-molecular orcryopump. However, there are low cost PVD systems such as the UlvacSRH-820 and the Sputtered Films, Inc. (SFI) ENDEAVOR, that use a single,common, centrally located high vacuum pump to evacuate all PVD processchambers. The lower cost systems that may be used for less criticalapplications can achieve such pumping with less concern for chambercross-contamination or interference.

High end, single wafer, PVD tools such as the Tokyo Electron LimitedECLIPSE Series, the Applied Materials ENDURA and the Novellus INOVA, forexample, are usually considered too expensive for dedication to low endfoundry packaging applications. Many foundries are able to useinexpensive, relatively inferior and lower throughput batch tools fortheir less critical PVD applications.

Single wafer tools have several advantages over batch machines forsilicon wafer processing. Single wafer systems lend themselves readilyto statistical process control, since every wafer experiences the sameprocess in the same position in a given process chamber. Also, in theevent of wafer breakage, usually all the wafers in a batch will be scrapdue to the particles generated when a wafer breaks; in a single wafersystem, only the wafer that breaks would be lost. A single wafer toolusually has a higher throughput for larger wafer sizes. As wafer sizeincreases, the number of wafers in a batch must decreasecorrespondingly. Consequently, there are compelling reasons for currentusers of inexpensive batch tools to convert to single wafer machines,provided that they are sufficiently inexpensive.

One such inexpensive single wafer tool is the Varian 3180 series tool.This tool is a cassette-to-cassette single wafer PVD tool, wheresputtering takes place in a large plenum with four sputtering stations.Features of this machine are described in U.S. Pat. Nos. 4,548,699 and4,716,815. Each station of this tool is directly opposed to a sputteringtarget. The wafers rotate sequentially from a first station to a last,and may be subjected to a sputter coating or other process at each ofthe stations. The plenum is pumped by a single cryopump. Onedisadvantage to this arrangement has been that all sputtering processestake place in a common ambient, at the same pressure. It is oftendesirable to sputter different metals in a stack at different pressures,for example, to optimize film stress, but this has not been possiblewith this kind of common plenum machine. Also, in many of such machines,there has been no easy way to isolate the sputtering ambient of thevarious chambers. In the event that a metal stack requires reactivesputtering, for example, using a mixture of argon and nitrogen todeposit titanium nitride, the processes in adjacent chambers could becontaminated by nitrogen.

Accordingly, there remains a need for a better way to use a commonvacuum pumping system in a multiple-chamber single-wafer tool.

SUMMARY OF THE INVENTION

A primary objective of the present invention is to allow a PVD systemwith multiple process chambers that are usually each pumped by adedicated high vacuum pump on each process chamber, to instead be pumpedby a single pump located remotely from the process chambers.

According to principles of the present invention, a multiplesingle-wafer process chamber apparatus is provided with a high vacuumpump connected to the apparatus via a plenum, a transfer chamber orother exhaust volume remote from the chambers. A gas flow conductancepath is provided from one or more of the chambers to the exhaust volume.One or more of such process chambers is provided with a set of one ormore shields that gives line-of-sight protection from deposition forcritical components in the process chamber, while allowing adequatevacuum conductance from the chamber through the path to the high vacuumpump. The shield set for that chamber is configured in such a way thatthe gas conductance to the exhaust volume provides a pressure drop thatallows the chamber to be operated at a desired processing pressure withthe pressure of the exhaust volume maintained sufficiently below theprocessing pressures of all of the chambers to sustain the flow of gasfrom the chambers toward the exhaust volume. The determination of shieldconfiguration is accompanied by establishment of a gas flow rate intothe chamber so that the pressure objectives are satisfied.

Where more than one or all of the chambers of the apparatus are providedwith such shields, one or more of the chambers can be operated at apressure that is significantly higher than that of the exhaust volume,and the operating pressures of different chambers can be different andcontrolled by a programmed controller. With the pressure of each chamberhigher than that of the exhaust volume, cross contamination among thechambers is reduced significantly so different gases and processes canbe used in the different chambers.

This may be accomplished, for example, by selecting a shield set designfor the chamber with the highest processing pressure to provide arelatively low gas conductance to the exhaust volume. The conductance ischosen that will allow the exhaust volume to maintain a relatively lowpressure that is sufficiently below that of all of the chambers. The gasflow rate into this high pressure chamber can be adjusted to optimizethe processing pressure in that chamber. Then the lower pressurechambers are provided with high conductance shield sets that allow thosechambers to operate at their respectively lower pressures, with the gasflow rates into those chambers also being adjusted to optimize thosepressures.

Typically, two shield sets may be used, one with relatively low gasconductance for the higher pressure chambers and one set with relativelyhigh gas conductance for the lower pressure chambers. Differences inprocessing pressures among the lower (or higher) pressure chambers canbe adjusted by varying the flow rates of processing gas injected intothose chambers. Maintaining sufficiently low pressure into the exhaustvolume must take into account the gases being exhausted into it from allof the chambers.

The sets of shields for a PVD system are designed to provide coverage ofthe chamber walls and other critical components that need to beprotected from deposition, yet provide a gas conductance path to avacuum pump connected to the exhaust volume that is located remotelyfrom the PVD chamber.

The configuration of the conductance paths depends on the apparatusplatform architecture. The pumping path can be through a plenum wall toa common plenum such as exists in the Tokyo Electron Limited ECLIPSESeries. The pumping path can alternatively be through a slot in thechamber wall that opens into a central transfer chamber such as existsin a traditional cluster tool.

The processing pressure in a chamber equipped with a shield or shieldset according to the present invention is a pressure that is distinctlyhigher than that of the exhaust volume. The chamber is maintained atthis distinctly higher pressure by the presence of a chamber shield toimpede the flow of gas from the chamber to the exhaust volume to thedegree that causes a pressure differential that produces the distinctlyhigher pressure. As used herein, “distinctly higher” pressure is apressure that is adequate for performance of the process, where thepressure in the exhaust volume is low enough to insure that there is gasflow from the chamber to the exhaust volume, typically of a few standardcubic centimeters per minute (sccm).

Although two embodiments are specifically described herein, one thatapplies to machines such as those of the Tokyo Electron ECLIPSE type,and the other that applies to the tools of the generic cluster tooltype, those skilled in the art will appreciate how to use the generalprinciples described herein for other types of equipment. Such equipmentmay be used for processing silicon wafers, or for other substrates, forexample, magnetic disks.

The present invention saves costs by reducing the number of expensivehigh-vacuum pumps. In addition, additional savings arise from theelimination of gate valves, reducing gauging, eliminating certainregeneration gas and pump out lines in the case of cryopumps, andeliminating certain fore-lines and backing pumps in the case ofturbo-molecular pumps.

The invention allows the use of a single high-vacuum pump to evacuateand maintain process pressure in a single-wafer PVD tool comprised ofseveral different process stations. This is achieved withoutcompromising shielding of critical surfaces within the tool. The natureof the shields, particularly the nested shields of certain embodiments,allows the conductance between the process station and vacuum pump to becarefully controlled, thus allowing different process pressures inadjacent processing chambers. Furthermore, in a tool design based upon aTokyo Electron Limited ECLIPSE or a standard cluster tool, the shieldscan easily be replaced with a conventional set of shields suitable foroperating the chambers with separate pumps. High vacuum pumps andisolation valves can then be added to one or more of the processstations so that reactive sputtering processes can then be run withoutmajor changes to the tool architecture. This provides flexibility notpossible with machines of the prior art. All the other advantages of asingle wafer PVD tool are retained.

These and other objectives and advantages of the present invention willbe readily apparent from the following detailed description of thedrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of one of the chambers of amulti-chamber single-wafer PVD apparatus of the prior art.

FIG. 2 is a cross-sectional view of a nested chamber shield installed inthe apparatus of FIG. 1 according to one embodiment of the presentinvention.

FIG. 3 is a cross-sectional view of a PVD processing module of a clustertool of the prior art.

FIG. 4 is a cross-sectional view of a nested chamber shield installed inthe apparatus of FIG. 3 according to an embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view through a PVD processing chamber or pod10 of a processing apparatus 12. The apparatus 12 is a semiconductorwafer processing machine of the type described in U.S. Pat. Nos.4,909,695; 4,915,564 and 5,516,732, each hereby expressly incorporatedherein by reference. Machines of this type are marketed under thetrademarks ECLIPSE, ECLIPSE MARK II, ECLIPSE STAR and ECLIPSE MARK IV byApplicant's assignee, Tokyo Electron Limited.

In the apparatus 12, five process stations, one of which is the pod 10,are situated at equal intervals, spaced 72° apart around a central axis13. Typically, and in the ECLIPSE-type machines referred to above, theaxis 13 is horizontal. An index plate 14 is enclosed in a plenum 11 inwhich it is mounted to rotate in a vertical plane on the axis 13 tocarry five wafer holders 15, each also spaced at equal 72° intervalsaround the axis 13. Each wafer holder 15 is capable of holding a singlesemiconductor wafer 16 therein for processing. Rotation of the indexplate 14 indexes the wafer holders 15 through each of the pods 10 toperform sequential processes on each of the wafers 16. Each of the waferholders 15 is supported in an opening in the index plate 14 by a sealingring 17. When a wafer holder 15 is positioned in a pod 10 forprocessing, a moveable cup-shaped chamber wall 18 clamps the sealingring 17 against a wall 19 of the plenum 11 to form a sealed processingchamber 20 within the pod 10.

When the processing chamber 20 is sealed, the wafer 16 is supported soas to face a sputtering target and cathode assembly 21 for theperformance of a PVD process on the wafer 16. A chamber shield 22 isfixed to the plenum wall 19 to shield the walls of the chamber 10 duringthe PVD process. A vacuum pump 23 is connected to the plenum 11 to pumpthe plenum 11 to a high vacuum, which also evacuates the pods 10 whenthe chambers 20 are open to the plenum 11. Each of the pods 10 is itselfequipped with a vacuum pump 24 to pump the respective chamber 20 to avacuum level as required for the process being performed in the pod 10.Each pod has a gas inlet line 25 for introducing processing gas into thechamber 20. The flow rate of processing gas into the inlet 25 is set bysetting the set point of a mass flow controller (not shown) and athrottle valve (not shown) at the pump 24 is controlled to maintain anappropriate pressure and gas flow rate in the chamber 20.

FIG. 2 is a diagrammatic cross section showing one manner in which theapparatus 12 of FIG. 1 can be modified according to the presentinvention. In FIG. 2, such a modified apparatus 12 a is provided inwhich a set 30 of nested shields is provided in place of the shield 22in the deposition chamber 20 of FIG. 1. The set 30 includes an outershield 31, which is configured to conform closely to the pod and plenumwall 19 a, and an inner shield 32. The shields 31 and 32 are nested withan annular space or gap 33 maintained between them. The outer shield 31may be supported on the chamber wall 19 a and the inner shield 32 may bemounted on standoffs (not shown) from the outer shield 31 or onalternative structure supported by the chamber wall 19 a.

A set of one or more slots 34 is cut in the outer shield incommunication with the annular space 33. The shields 31 and 32 aredimensioned to fit into a modified deposition pod 10 a of a tool 12 ofthe Eclipse type, with the pod 10 modified with a set of slots 36 formedin the plenum wall 19 a. The slots 36 align with the slots 34 in theouter shield 31 so that pumping for the deposition pod 10 is effectedthrough the series of circumferential slots 34 and 36, which may be, forexample, about one inch wide, machined into the wall 19 a of the plenum11 and extending about half way around the circumference of the chamberto communicate with the vacuum within the plenum 11. This dimension isnominal, and can be smaller or larger, depending on the gas flowconductance desired, as explained below. Examples of slotcross-sectional area are 25 square inches, 50 square inches, or suchother larger or smaller areas that are effective to provide the gasconductance needed to satisfy pressure criteria as explained herein.

The outer shield 31 is essentially a “skin,” which fits inside the pod10 a and may conform to or be spaced closely from the chamber walls 19a. The shield 31 primarily protects all internal surfaces of the plenum11 from unwanted deposition. This outer shield 31 is positioned in thechamber 20 with its slots 34 in alignment with the pumping slots 36machined into the plenum wall 19 a. The inner shield 32 covers theseslots, and extends sufficiently far up the side of the pod 10 a so as torequire at least three specular reflections off shield surfaces beforemetal atoms from the target can deposit onto the exposed surface of theslots 36 in the plenum wall 19 a. The slots 34 and 36 allow the pump 23to be used to maintain a vacuum in the chamber 20, rather than requiringa dedicated pump such as pump 24 for the chamber 20.

The spacing 33 between inner shield 32 and outer shield 31 may bemaximized as far as the pod and cathode geometry allow. Nonetheless, thegas flow conductance between the chamber 20 and the vacuum pump thatpumps the chamber is reduced significantly by the shield set 30 comparedto a normal Eclipse set up. The pumping speed and the reduction thereof,in liters per second (I/s), is gas dependent, as illustrated in Table I:TABLE I PUMPING VIA PLENUM WITH NESTED SHIELDS Ar N₂ H₂O H₂ S_(cryo)1,200 1,500 4,000 2,500 U_(cryo) 3,175 3,795 4,733 14,200 C_(valve)2,278 2,723 3,396 10,189 S_(net cryo-to-plenum) 1,045 1,298 3,001 2,338C_(nested shield) 280 335 418 1,253 S_(plenum pump @ process pod) 221265 357 816 _((estimate)) Ratio S_(pod)/S_(plenum) 3.54 3.61 4.96 2.21

In Table I, S denotes the pumping speed, U the aperture conductance, andC the vacuum conductance in molecular flow, respectively. The last row,ratio S_(pod)/S_(plenum), compares the pumping speed of a typicalapparatus 12 of the ECLIPSE configuration, where the process pod ispumped by a dedicated cryopump connected to the pod through a gatevalve, to that obtained when the process pod is pumped with the plenumcryopump through a set of nested shields as proposed here. The values inthe table are appropriate where the inside diameter of the pod orchamber is about 14 inches, with the outer shield 31 having a nominaloutside diameter of about 14 inches, the diameter of the inner shield 32being about 12 inches, leaving the width of the gap 33 about one inch.

The net result of using the shield set 30 in the arrangement detailed inFIG. 2 is to reduce the pumping speed of a typical 1200 l/s (liter persecond) cryopump to between 200 and 300 l/s for argon. This is typicalof cryopumps equipped with sputter plates, which are metal plates with aseries of holes that are heat-sunk to the first stage of the cryopumpand provide a reduction in permanent gas pumping speed, whilemaintaining full water pumping speed. Many PVD tool manufacturers usesputter plates to increase the time between cryopump regenerations,which must occur when argon ice builds up inside the pump.

The water pumping speed for the pod 10 a of an ECLIPSE type apparatus 12a that is equipped with a shield set 30, and using the plenum pump 23 topump the chamber 20, will be reduced substantially compared to a machineusing a separate pump 24 for the chamber 20. While this might not besuitable for some applications, for many packaging applications thiswill be an acceptable and economical system.

To test the effect of reduced water pumping speed on the properties of atypical UBM stack, a tri-layer stack Cr/CrCu/Cu was deposited with thepod cryopump throttled so as to simulate the pumping speed which wouldresult from pumping through the plenum. The properties of eachindividual film and the overall stack were monitored over 100 waferdepositions, and compared to the controls (films that were depositedwith the regular pod pumping speeds). No discernible differences wereobserved. The vacuum conditions of many of the batch tools used todeposit under-bump-metal (UBM) films are much worse than those observedin pods 10 of the ECLIPSE type with heavily throttled cryopumps.

The use of nested shield sets 30 in combination with a single cryopumpin a common location, such as pump 23 connected to the plenum 11, butwith separate control of individual process gas injection points 25 ineach of the individual process pods by a programmed controller 29,allows different process pressures in various pods 10 a to result with asingle pump 23. The process gas injection into the chambers 20 iscontrolled by setting the pressure on a mass flow controller, which maybe provided with a feedback loop to maintain the pressure setting. Inthis way, films can be deposited underoptimum pressure conditions oftennot practical in batch tools or in the Varian 3180 series. This requiresprocess pressure control of the gas inlets 25 of each of the processpods 10. Each of the gas inlets 25 includes an inlet tube that extendsfrom a gas source (not shown) outside of the chamber, through thechamber wall and through holes in the shields 31 and 32 into theprocessing space adjacent the wafer, as shown in FIG. 2. A pressuresensor 27 is similarly connected through a tube through holes in theshields 31,32 to sense the pressure directly from this processing space.

The operation of pods 10 a attached to a common pump 23 at different podpressures could lead to possible “cross-talk” between pods 10 a, wheregas back-streams from the plenum 11 to one of the process pods 10 a,which could occur when one or more of the common pods 10 operates atsignificantly higher pressures than the other pods. To reduce thepossibility of this potential problem, different sets 30 of shields 31and 32 are provided for the pods 10 a for processes that operate athigher pressures than for processes that operate at much lowerpressures. Such shield sets 30 would be designed to have less gas flowconductance for higher pressure processes than the nested shield sets 30for low pressure processes. The conductance could be reduced for pods 10a used for higher pressure processes either by reducing the annular gap33 between inner shield 32 and outer shield 31 or by reducing the widthof the slots 34 in the outer shield 31 to be less than the slots 36 inthe plenum wall 19 a. Of these two approaches, reducing the width of theslots 34 has the advantage of allowing the use of the same inner shield32 for both high and low pressure processes, thereby keeping the processenvironment similar for all processes, and thereby reducing theoccurrence of subtle effects that might arise if the inner shielddimensions were different for high and low pressure processes.

The process pressure threshold for using the low conductance shield setmay be determined empirically, as could the exact shield geometry. Byusing the low conductance shield set, less process gas would be requiredto sustain the appropriate process pressure, thus avoiding anyunnecessary pressure rise in the plenum 11. This, in turn, reduces thepotential for back-streaming into those process pods operating at lowerpressures. Because lower conductance shield sets reduce the effectivepumping speed of the process pods equipped with the low conductancenested shield sets, tests are used to ascertain which films, if any, aresensitive to further reductions in effective pumping speed.

A set of shields may be provided that completely close off the pumpingslots 36 machined into the plenum wall 19 a. Then equipping that podonly with a separate cryopump 24 a and isolation valve 24 b would enablethe particular pod to be used for reactive sputtering without risk ofcontamination of the adjacent sputtering processes. The implementationof the nested shield sets concept in the Tokyo Electron ECLIPSE-typemachines requires minor modification to the plenum wall. As notedpreviously, slots 36 must be machined to enable the high vacuum pump onthe plenum 11 to pump the process pods 10 a.

FIG. 3 is a cross section of a PVD module 50 of a type found on acluster tool. The module 50 is attached to a transport chamber or module52 in the configuration of the cluster tool, and a robot (not shown)loads and unloads wafers from the processing module 50 through a port53. Usually, the PVD module 50 is isolated from the transport chamber 52by a valve 53 a at the port 53. The valve 53 a is typically arectangular gate valve often referred to as a slit valve. A dedicatedhigh vacuum pump 54, usually a cryopump, pumps the module 50 to basepressure during wafer processing. This cryopump is, in turn, isolatedfrom the module by a valve (not shown), most commonly a gate valve. Thepump 54 maintains a vacuum in the processing chamber 55 duringprocessing.

The processing chamber 55 is enclosed by a chamber wall 56 that containsan upwardly facing wafer support 57. A chamber shield assembly 58protects the chamber wall from deposition from a PVD source 59 thatfaces downwardly from the top of the chamber 55. Processing gas isintroduced into the chamber 55 through ports (not shown) that may be inthe source 59 or the chamber wall 56.

Pumping the process module 50 through the transport module 52, accordingto the present invention, eliminates the need for a separate pump 54, asillustrated in FIG. 4. Similarly, isolation valves 53 a at the gate 53and at the pump 54 on the module 50 can be eliminated. A nested shieldset 60 replaces the shield 58 and is designed so that an outer shield 61forms a “skin” that conforms to the inside of the chamber wall 56 or isspaced closely from it. A slot 63 is formed in the outer shield 61 thataligns with the gate opening or slot 53 in the chamber wall 56 that isused by a robot (not shown) from the transfer chamber 52 to load andunload wafers to and from the support 57 through the slot 53.

For 200 mm diameter wafers and larger, the aperture gas flow conductanceof such a slot 53 is sufficient to provide the pumping speed requiredfor non-critical packaging applications by pumping the module 50 throughthe slot 53 with the pump of the transfer module 52. The shield set 60includes an inner shield 62 that is designed so that an annular space 64between the two nested shields 61 and 62 is sized to provide adequategas flow conductance for pumping of the chamber 55 through the slots 63and 53. The upper rim of the shield 62 also extends sufficiently pastthe slot 63 to ensure that metal atoms sputtered from the target of thesource 59 must undergo at least three specular reflections before theycan deposit on any unshielded region of the chamber wall 56 or insidethe slot 53. Depending on the way that wafers are handled in the PVDmodule 50, the inner shield 62 may be constructed with a slot to allowplacement of a wafer on the substrate holder 57 by the robot.Alternatively, the inner shield 62 can be mounted on actuators 66, asshown, that allow the shield 62 to be moved up and down to allowplacement of the wafer on the substrate holder 57 by passing it over thetop of the shield 62, and to position the shield 62 relative to thesubstrate holder 57, which is often vertically adjustable. In the mostcommon “sputter down” case, the inner shield 62 is lowered for waferload and unload to allow robot access to the substrate holder 57, andraised during processing to protect the unshielded surfaces of the slot53 from deposition.

To add the nested shield set 60 to a generic cluster tool module 50 sothat the module can be pumped by the pump of the transfer module 52, nomodifications are necessary to the hardware of the module 50. Thegeometries of the shield set 60 and its position in relationship to thechamber walls 56 and control of the flow of injected gas into thechamber 55 allow for regulation of the pressure in the chamber 55, aswith the chamber of the apparatus of FIG. 2 described above. Differentprocessing pressures can be accommodated by locating a gas injectionport on each of the individual process modules. If there was a need torun a high pressure process in one of the modules and to preventback-streaming from the transfer chamber 52 to other modules running atlower processing pressures, the gas flow conductance of the shield sets60 can be changed to accommodate this. Restricting the apertureconductance of the outer shield 61 can be achieved where it covers theslot 53, provided this can be done without interfering with the robotarm during wafer load and unload. Alternatively, the annular gap betweenthe shields can be changed to adjust gas flow conductance, for example,it can be narrowed to reduce conductance to allow higher pressure in thechamber 55. This approach would employ different inner shields 62 forhigh and low pressure processes.

Another approach to reducing gas flow conductance is to mount a baffleshield 67 on the same actuator 66 that raises and lowers the innershield 62. In the raised position of the actuator 66, the baffle shield67 would cover the pumping slot 53, thus lowering its conductance to thedesired value. The configuration and position of the baffle for bestperformance may be determined empirically.

To perform reactive sputtering in a cluster tool module 50 that isconfigured with a nested shield set 60, a separate pump 54 (FIG. 3)could be installed or reinstalled on the module 50, along withassociated isolation valve. In addition, the isolation valve 53 a thatisolates the chamber 55 from the transfer module 52 would bereinstalled. No architectural modifications to the module 50 would benecessary. The outer shield 61 would be modified by forming a hole inthe outer shield 61 to align with the cryopump, so as to allow pumping.The inner nested shield 62 could remain unchanged.

From the above description, it will be readily apparent to those skilledin the art that modifications and additions thereto can be made withoutdeparting from the principles of the present invention. The concepts canbe modified and adapted for use in tool architectures of variousmanufacturers.

1. A set of replaceable protective deposition shields for a PVDprocessing chamber comprising: an outer shield having a generallycylindrical portion and a gas outlet opening therethrough and a gasinlet opening therethrough; an inner shield having a generallycylindrical portion of a diameter less than that of the generallycylindrical portion of the outer shield and having an inlet openingtherethrough for alignment with the inlet opening of the outer shield;and the inner shield being configured to mount in a nested relationshipwith the outer so as to form an annular gap between the inner and outershields that communicates with the opening and that extends sufficientlyfrom the opening so as to require at least three specular reflectionsoff shield surfaces of atoms of coating material moving from the chamberto the opening when the set is installed in a process chamber and a PVDprocess is being performed in the process chamber.
 2. Two sets ofreplaceable protective deposition shields of claim 1, each set beingdifferently configured so as to differently impede gas flow from thechambers.
 3. A PVD apparatus comprising the protective set ofreplaceable deposition shields of claim 1 and further comprising: aplurality of single-wafer processing chambers; a high vacuum pump; anexhaust volume communicating with the high vacuum pump; and a gas flowconductance path extending from at least one of the chambers to theexhaust volume; and the protective set of replaceable deposition shieldsbeing installed in the at least one of the chambers with the opening inthe outer shield aligned with the gas flow conductance path.
 4. The PVDapparatus of claim 3 further comprising: a processing gas supplyconnected to the at least one of the chambers; and a controllerprogrammed to control the processing of wafers in the chambers bycontrolling the supply of process gas into at least said one of thechambers such that gas flows from the chamber, through the path and tothe exhaust volume, and such that the chamber is maintained at acontrolled processing pressure that is higher than the pressure at theexhaust volume.
 5. The PVD apparatus of claim 3 further comprising: agas flow conductance path extending from at least two of the chambers tothe exhaust volume; and a protective set of replaceable depositionshields being installed in the at least two of the chambers with theopening in the outer shield of the set aligned with the gas flowconductance path from the chamber.
 6. The PVD apparatus of claim 5further comprising: a processing gas supply connected to each of the atleast two of the chambers; and a controller programmed to control theprocessing of wafers in the chambers by controlling the supply ofprocess gas into each of the at least two of the chambers such that gasflows from the chamber, through the path and to the exhaust volume, andsuch that each of the at least two chambers is maintained at a differentcontrolled processing pressure that is higher than the pressure at theexhaust volume.
 7. A PVD apparatus comprising: a plurality ofsingle-wafer processing chambers bounded by chamber walls; a high vacuumpump; an exhaust volume communicating with the high vacuum pump; a gasflow conductance path extending from at least one of the chambers to theexhaust volume; a protective deposition shield installed in the at leastone of the chambers configured to substantially protect walls of thechamber and the gas flow conductance path from deposition from thechamber, and to partially impede the gas flow from the chamber throughthe gas flow conductance path to the exhaust volume so that the chambercan be operated at a higher pressure than that of the exhaust volume;and a controller programmed to control the processing of wafers in thechambers by controlling the supply of process gas into said one of thechambers such that gas flows from the chamber, through the path and tothe exhaust volume, and such that the chamber can be maintained at acontrolled processing pressure that is higher than the pressure at theexhaust volume.
 8. The PVD apparatus of claim 7 further comprising: aprocessing gas supply connected to the at least one of the chambers; andthe controller being programmed to control the processing of wafers inthe chambers by controlling the supply of process gas into at least saidone of the chambers such that gas flows from the chamber, through thepath and to the exhaust volume, and such that the chamber is maintainedat a controlled processing pressure that is higher than the pressure atthe exhaust volume.
 9. The PVD apparatus of claim 7 further comprising:a gas flow conductance path extending from at least two of the chambersto the exhaust volume; a protective deposition shield being installed inthe at least two of the chambers configured to substantially protectwalls of the respective chambers and the gas flow conductance paths fromdeposition from the chambers, and to partially impede the gas flow fromthe chambers through the gas flow conductance paths to the exhaustvolume so that each chamber can be operated at a higher pressure thanthat of the exhaust volume; and the controller being programmed tocontrol the processing of wafers in the chambers by controlling thesupply of process gas into each of said two of the chambers such thatgas flows from the chamber, through the respective path and to theexhaust volume, and such that each chamber is maintained at a differentcontrolled processing pressure that is higher than the pressure at theexhaust volume.
 10. The PVD apparatus of claim 9 further comprising: aplenum having an index plate lying in a vertical plane and mounted torotate on a horizontal axis therein, a plurality of wafer holders beingspaced around the axis on the index plate; the plurality of single-waferprocessing chambers being spaced at intervals around the plenum foralignment with holders on the index plate; a plurality of gas flowconductance paths each extending from each of the at least two of thechambers to the exhaust volume; and each of the at least two chambershaving a protective deposition shield installed therein configured tosubstantially protect walls of the chamber and the gas flow conductancepath from deposition from the chamber, and to partially impede the gasflow from the chamber through the gas flow conductance path to theexhaust volume so that the at least two chambers can be operated atdifferent pressures, at least one being higher than that of the exhaustvolume.
 11. The PVD apparatus of claim 7 further comprising: a waferprocessing module having the at least one chamber therein; a transfermodule removably connected to the processing module and having theexhaust volume therein to which the chamber of the processing module isconnected through the flow conductance path; and the controller beingprogrammed to control the processing of wafers in the chamber in theprocessing module by controlling the supply of process gas into saidchamber such that gas flows from the chamber, through the path and tothe exhaust volume, and such that the chamber is maintained at acontrolled processing pressure that is higher than the pressure at theexhaust volume.
 12. The PVD apparatus of claim 11 wherein: the transfermodule includes a transfer arm moveable to pass a wafer between thetransfer module and the processing module through the flow conductancepath; the protective deposition shield being moveable in response to thecontroller to so partially impede the gas flow from the chamber throughthe gas flow conductance path to the exhaust volume during processing inthe processing module and away from the gas flow path when a wafer isbeing passed therethrough.
 13. The PVD apparatus of claim 12 furthercomprising: a baffle moveable with the shield into and out of the gasflow path.
 14. The PVD apparatus of claim 7 further comprising: at leasttwo wafer processing modules, each having a chamber therein; a transfermodule removably connected to each processing module and having theexhaust volume therein; each processing module having a flow conductancepath connecting the chamber thereof to the exhaust volume; the chamberof each processing module having a shield therein configured tosubstantially protect walls of the chamber and the respective gas flowconductance path from deposition from the chamber, and to partiallyimpede the gas flow from the respective chamber through the respectivegas flow conductance path to the exhaust volume; and the controllerbeing programmed to control the processing of wafers in the chambers inthe processing modules by controlling the supply of process gas intosaid chambers such that gas flows from the respective chamber, throughthe respective path and to the exhaust volume, and such that thepressure in one chamber is maintained at a controlled processingpressure that is higher than the pressure in another chamber.
 15. ThePVD apparatus of claim 14 further comprising: the transfer moduleincludes a transfer arm moveable to pass a wafer between the transfermodule and the processing modules through the respective flowconductance paths thereof; the protective deposition shields in eachprocessing module being moveable in response to the controller to sopartially impede the gas flow from the chamber through the gas flowconductance path to the exhaust volume during processing in theprocessing module and away from the gas flow path when a wafer is beingpassed therethrough; one of the processing modules being configured toperform a process therein at a pressure that is higher than that of theother processing module and provided with a baffle moveable with theshield therein into and out of the gas flow path.